Scalable, Robust PCB Connections in SMT

The SMT PCB connectors of the Zero8 series reliably connect PCBs with data transfer rates of up to 16 Gbit/s.
ScaleX

Features

  • Up to 16 Gbit/s
  • 12 to 80 contacts
  • 1.7 A current carrying capacity
  • 500 mating cycles
  • Maximum contact reliability
  • Optimized protection against faulty connection
  • Packed in tape and reel

Applications

  • Board-to-board (mezzanine) of 6–20 mm
  • Parallel and right-angled connections
  • Optional: Unshielded versions
Plug straight shielded

Zero8 plug mid-profile shielded Part No. 405-53112-51

Zero8 12polig Plug Mid Geschirmt Foto
12 pins, unmated stacking height: 2.65 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug mid-profile shielded Part No. 405-53112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance7.50 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug mid-profile shielded Part No. 405-53120-51

Zero8 20polig Plug Mid Geschirmt Foto
20 pins, unmated stacking height: 2.65 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug mid-profile shielded Part No. 405-53120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance7.50 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug mid-profile shielded Part No. 405-53132-51

Zero8 32polig Plug Mid Geschirmt Foto
32 pins, unmated stacking height: 2.65 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug mid-profile shielded Part No. 405-53132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance7.50 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug mid-profile shielded Part No. 405-53152-51

Zero8 52polig Plug Mid Geschirmt Foto
52 pins, unmated stacking height: 2.65 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug mid-profile shielded Part No. 405-53152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance7.50 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug mid-profile shielded Part No. 405-53180-51

Zero8 80polig Plug Mid Geschirmt Foto
80 pins, unmated stacking height: 2.65 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug mid-profile shielded Part No. 405-53180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance7.50 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug low-profile shielded Part No. 405-52112-51

Zero8 12polig Plug Low Geschirmt Foto
12 pins, unmated stacking height: 1.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug low-profile shielded Part No. 405-52112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance6.00 mm to 10.50 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug low-profile shielded Part No. 405-52120-51

Zero8 20polig Plug Low Geschirmt Foto
20 pins, unmated stacking height: 1.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug low-profile shielded Part No. 405-52120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance6.00 mm to 10.50 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug low-profile shielded Part No. 405-52132-51

Zero8 32polig Plug Low Geschirmt Foto
32 pins, unmated stacking height: 1.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug low-profile shielded Part No. 405-52132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance6.00 mm to 10.50 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug low-profile shielded Part No. 405-52152-51

Zero8 52polig Plug Low Geschirmt Foto
52 pins, unmated stacking height: 1.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug low-profile shielded Part No. 405-52152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance6.00 mm to 10.50 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug low-profile shielded Part No. 405-52180-51

Zero8 80polig Plug Low Geschirmt Foto
80 pins, unmated stacking height: 1.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug low-profile shielded Part No. 405-52180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance6.00 mm to 7.50 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Socket straight shielded

Zero8 socket mid-profile shielded Part No. 406-53112-51

Zero8 12polig Socket Mid Geschirmt Foto
12 pins, unmated stacking height: 7.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket mid-profile shielded Part No. 406-53112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance9.00 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket mid-profile shielded Part No. 406-53120-51

Zero8 20polig Socket Mid Geschirmt Foto
20 pins, unmated stacking height: 7.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket mid-profile shielded Part No. 406-53120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance9.00 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket mid-profile shielded Part No. 406-53132-51

Zero8 32polig Socket Mid Geschirmt Foto
32 pins, unmated stacking height: 7.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket mid-profile shielded Part No. 406-53132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance9.00 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket mid-profile shielded Part No. 406-53152-51

Zero8 52polig Socket Mid Geschirmt Foto
52 pins, unmated stacking height: 7.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket mid-profile shielded Part No. 406-53152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance9.00 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket mid-profile shielded Part No. 406-53180-51

Zero8 80polig Socket Mid Geschirmt Foto
80 pins, unmated stacking height: 7.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket mid-profile shielded Part No. 406-53180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance9.00 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket low-profile shielded Part No. 406-52112-51

Zero8 12polig Socket Low Geschirmt Foto
12 pins, unmated stacking height: 4.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket low-profile shielded Part No. 406-52112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance6.00 mm bis 9.00 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket low-profile shielded Part No. 406-52120-51

Zero8 20polig Socket Low Geschirmt Foto
20 pins, unmated stacking height: 4.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket low-profile shielded Part No. 406-52120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance6.00 mm bis 9.00 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket low-profile shielded Part No. 406-52132-51

Zero8 32polig Socket Low Geschirmt Foto
32 pins, unmated stacking height: 4.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket low-profile shielded Part No. 406-52132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance6.00 mm bis 9.00 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket low-profile shielded Part No. 406-52152-51

Zero8 52polig Socket Low Geschirmt Foto
52 pins, unmated stacking height: 4.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket low-profile shielded Part No. 406-52152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance6.00 mm bis 9.00 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket low-profile shielded Part No. 406-52180-51

Zero8 80polig Socket Low Geschirmt Foto
80 pins, unmated stacking height: 4.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket low-profile shielded Part No. 406-52180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance6.00 mm bis 9.00 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Socket angled shielded

Zero8 socket angled shielded Part No. 406-51112-51

Zero8 12polig Socket gewinkelt geschirmt Foto
12 pins, right angled, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket angled shielded Part No. 406-51112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket angled shielded Part No. 406-51120-51

Zero8 20polig Socket gewinkelt geschirmt Foto
20 pins, right angled, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket angled shielded Part No. 406-51120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket angled shielded Part No. 406-51132-51

Zero8 32polig Socket gewinkelt geschirmt Foto
32 pins, right angled, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket angled shielded Part No. 406-51132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket angled shielded Part No. 406-51152-51

Zero8 52polig Socket gewinkelt geschirmt Foto
52 pins, right angled, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket angled shielded Part No. 406-51152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket angled shielded Part No. 406-51180-51

Zero8 80polig Socket gewinkelt geschirmt Foto
80 pins, right angled, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket angled shielded Part No. 406-51180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Plug straight unshielded

Zero8 plug low-profile unshielded Part No. 405-52012-51

Zero8 12polig Plug Low Ungeschirmt Foto
12 pins, unmated stacking height: 1.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug low-profile unshielded Part No. 405-52012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance6.00 mm to 10.50 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug low-profile unshielded Part No. 405-52020-51

Zero8 20polig Plug Low Ungeschirmt Foto
20 pins, unmated stacking height: 1.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug low-profile unshielded Part No. 405-52020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance6.00 mm to 10.50 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug low-profile unshielded Part No. 405-52032-51

Zero8 32polig Plug Low Ungeschirmt Foto
32 pins, unmated stacking height: 1.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug low-profile unshielded Part No. 405-52032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance6.00 mm to 10.50 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug low-profile unshielded Part No. 405-52052-51

Zero8 52polig Plug Low Ungeschirmt Foto
52 pins, unmated stacking height: 1.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug low-profile unshielded Part No. 405-52052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance6.00 mm to 10.50 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug low-profile unshielded Part No. 405-52080-51

Zero8 80polig Plug Low Ungeschirmt Foto
80 pins, unmated stacking height: 1.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug low-profile unshielded Part No. 405-52080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance6.00 mm to 10.50 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug mid-profile unshielded Part No. 405-53012-51

Zero8 12polig Plug Mid Ungeschirmt Foto
12 pins, unmated stacking height: 2.65 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug mid-profile unshielded Part No. 405-53012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance7.50 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug mid-profile unshielded Part No. 405-53020-51

Zero8 20polig Plug Mid Ungeschirmt Foto
20 pins, unmated stacking height: 2.65 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug mid-profile unshielded Part No. 405-53020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance7.50 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug mid-profile unshielded Part No. 405-53032-51

Zero8 32polig Plug Mid Ungeschirmt Foto
32 pins, unmated stacking height: 2.65 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug mid-profile unshielded Part No. 405-53032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance7.50 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug mid-profile unshielded Part No. 405-53052-51

Zero8 52polig Plug Mid Ungeschirmt Foto
52 pins, unmated stacking height: 2.65 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug mid-profile unshielded Part No. 405-53052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance7.50 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 plug mid-profile unshielded Part No. 405-53080-51

Zero8 80polig Plug Mid Ungeschirmt Foto
80 pins, unmated stacking height: 2.65 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug mid-profile unshielded Part No. 405-53080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance7.50 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Socket straight unshielded

Zero8 socket low-profile unshielded Part No. 406-52012-51

Zero8 12polig Socket Low Ungeschirmt Foto
12 pins, unmated stacking height: 4.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket low-profile unshielded Part No. 406-52012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance6.00 mm bis 9.00 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket low-profile unshielded Part No. 406-52020-51

Zero8 20polig Socket Low Ungeschirmt Foto
20 pins, unmated stacking height: 4.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket low-profile unshielded Part No. 406-52020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance6.00 mm bis 9.00 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket low-profile unshielded Part No. 406-52032-51

Zero8 32polig Socket Low Ungeschirmt Foto
32 pins, unmated stacking height: 4.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket low-profile unshielded Part No. 406-52032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance6.00 mm bis 9.00 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket low-profile unshielded Part No. 406-52052-51

Zero8 52polig Socket Low Ungeschirmt Foto
52 pins, unmated stacking height: 4.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket low-profile unshielded Part No. 406-52052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance6.00 mm bis 9.00 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket low-profile unshielded Part No. 406-52080-51

Zero8 80polig Socket Low Ungeschirmt Foto
80 pins, unmated stacking height: 4.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket low-profile unshielded Part No. 406-52080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance6.00 mm bis 9.00 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket mid-profile unshielded Part No. 406-53012-51

Zero8 12polig Socket Mid Ungeschirmt Foto
12 pins, unmated stacking height: 7.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket mid-profile unshielded Part No. 406-53012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance9.00 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket mid-profile unshielded Part No. 406-53020-51

Zero8 20polig Socket Mid Ungeschirmt Foto
20 pins, unmated stacking height: 7.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket mid-profile unshielded Part No. 406-53020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance9.00 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket mid-profile unshielded Part No. 406-53032-51

Zero8 32polig Socket Mid Ungeschirmt Foto
32 pins, unmated stacking height: 7.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket mid-profile unshielded Part No. 406-53032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance9.00 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket mid-profile unshielded Part No. 406-53052-51

Zero8 52polig Socket Mid Ungeschirmt Foto
52 pins, unmated stacking height: 7.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket mid-profile unshielded Part No. 406-53052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance9.00 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket mid-profile unshielded Part No. 406-53080-51

Zero8 80polig Socket Mid Ungeschirmt Foto
80 pins, unmated stacking height: 7.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket mid-profile unshielded Part No. 406-53080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance9.00 mm bis 12.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Socket angled unshielded

Zero8 socket angled unshielded Part No. 406-51012-51

Zero8 12polig Socket gewinkelt ungeschirmt Foto
12 pins, right angled, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 socket angled unshielded Part No. 406-51012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket angled unshielded Part No. 406-51020-51

Zero8 20polig Socket gewinkelt ungeschirmt Foto
20 pins, right angled, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 socket angled unshielded Part No. 406-51020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket angled unshielded Part No. 406-51032-51

Zero8 32polig Socket gewinkelt ungeschirmt Foto
32 pins, right angled, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 socket angled unshielded Part No. 406-51032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket angled unshielded Part No. 406-51052-51

Zero8 52polig Socket gewinkelt ungeschirmt Foto
52 pins, right angled, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 socket angled unshielded Part No. 406-51052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Zero8 socket angled unshielded Part No. 406-51080-51

Zero8 80polig Socket gewinkelt ungeschirmt Foto
80 pins, right angled, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 socket angled unshielded Part No. 406-51080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A at 20°C (52 pins)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform

Video of Zero8 plug connector

What does the new ScaleX technology offer? How does the double-sided contacting work?
What data rates can you achieve with Zero8 connectors? What does the closed shield concept offer you?
How flexibly can your devices be designed with Zero8 PCB connectors?

This brief animated video provides you with answers to your questions. Take a quick look on Youtube!

Features of the 0.8 mm SMT PCB connector with ScaleX technology

ScaleX
ScaleX – this brand stands for double-sided, robust contact technology in a plug connector system that can be scaled on a variable basis.

Place your trust in reliable contacting, even under difficult operating conditions and challenges such as vibrations and shock! At the same time, you’ll enjoy the full flexibility that the plug connector system’s scalability provides with respect to the number of contacts, board-to-board spacing and orientation, as well as optional EMC shielding.
image
Zero SMT Socket

detail overview

image
twist guard

for correct connection of plug and socket

image
insertion chamfer

for compensation of misalignment and angular inclination

image
boardlock

absorbs mechanical stress and ensures a reliable connection to the PCB

image
positioning pins

optimal processing through precise positioning

image
coplanarity

soldering under controlled process conditions

image
solder meniscus

guarantees a robust surface mount connection

image
Zero SMT Plug

detail overview

image
double sided contact system

double sided contact system for a secure connection in the industrial environment (shock, vibration, thermal cycles, corrosive gas)

image
smooth contact surface

smooth surface: the contact on the homogenous rolled side with high-end surface allows for up to 500 mating cycles

image
protected contacts

optimized contact and casing geometry reduce damage to contacts

image
data flow

HF optimized contact geometry ensures data transfer speeds of up to 16 Gpbs

image
EMC shielding

double sided shielding ensures a high electromagnetic compatibility for optimal signal integrity in the industrial environment

image
tolerance compensation

high reliability through tolerance compensation

Flexible board-to-board distances and EMC shielding

ept’s Zero8 plug connectors make it possible to implement board-to-board distances of 6.00 to 20.00 mm.
The minimum possible board-to-board distance is achieved via plugging to the stop.
The plug and socket can be variably inserted within a range of 1.5 mm to achieve the maximum possible board-to-board distance. The remaining 0.8 mm guarantee reliable contacting.
Flexible Leiterplattenabstaende 1
The multi-pole connectors from the manufacturer ept do not have to be plugged in as far as they will go. Due to the overmating range of 2.3 mm, the ept connectors fit exactly into your applications. Plug and socket can be plugged variably within a range of 1.5 mm without affecting the data transmission. Depending on the requirements, PCB distances of 6.00 to 20.00 mm can be realised.
Flexible Leiterplattenabstaende 2
The minimum possible PCB spacing is achieved by plugging to the stop. For the greatest possible distance, insert the plug and socket only 0.8 mm into each other. This contact area is already sufficient to ensure a fast and secure connection.

Electromagnetic compatibility

With increasing installation density, the risk of mutual electromagnetic interference increases. To prevent this, connectors with shielding are used that have better electromagnetic compatibility (EMC). EMC is crucial for the interference-free functioning of electrical components and applications.
Platinen Steckverbinder 1
The shielding concept on both sides guarantees interference-free, high-speed transmission in the industrial environment: The integrated shield material is especially suitable for components with high requirements in terms of electromagnetic compatibility and guarantees coupling inductance of max. 10 pH for the PCB connectors.
The coupling inductance makes it possible to simulate the influences of the electrical and magnetic field strengths on the plug connectors.
Platinen Steckverbinder 2
The large-scale shield concept reliably diverts interference currents via the multiple contacting points to both PCBs in the direction of the ground connection.

The shield concept guarantees reliable contacting at all times for individual board-to-board distances of 6–20 mm with a secure-mating range of 2.3 mm.

The shield concept not only protects the PCB connector against electromagnetic influence (interference suppressor) but also adjacent components when the PCB connector functions as a source of interference.

Zero8 SMT PCB Connector with 0.8 mm Pitch

leiterplatten steckverbinder
"Looking for a PCB connector that is robust, shielded, and guarantees reliable contact? One that can ideally be scaled to your individual requirements as well?

Our Zero8 product range was developed especially for demanding industrial applications while simultaneously offering ultimate scalability: This lets you customize the construction types, stack height, and number of contacts to meet your individual needs. The socket and plug are currently available in the mid-profile type and will also be available in the low-profile and angled versions in the future. Thanks to their various structural heights, the Zero8 PCB connectors let you implement board-to-board distances of 6.00 to 20.00 mm. You can request a variable number of contacts between 12 and 80.
There is more: You even have a choice when it comes to EMC protection! The entire connector pair with or without shielding? Or how about just shielding one of the two connectors? The decision is yours – either way all Zero8 connectors are intermatable with each other and can be combined freely, whether their shielded or not.
The robust, double-sided ScaleX connection technology stands up to the difficult conditions found in industrial applications and guarantees secure contacting under exposure to mechanical stress such as shock and vibrations. In addition, it compensates for tolerances on the device side in all directions when connected. Thanks to its EMC shielding, your signals are perfectly protected against external influences in the industrial environment, and the material composition guarantees a data transmission rate of up to 16 Gbit/s.
We have also thought one step ahead: The plug geometry is designed so the contacts cannot be damaged even in the event of faulty operation.

Experience our Zero8 range’s performance for yourself and request your free sample today!"

Andreas Krinninger, Project Manager Product Developement at ept GmbH

FAQ: Questions and answers regarding Zero8 SMT PCB plug connectors

How can Zero8 SMT PCB connectors be processed?How can circuit boards be connected with one another using the Zero8 SMT connectors?Which currents can be transmitted with the Zero8 PCB connectors?What is the highlight of the new connection concept?What does ScaleX technology stand for?For which data transmission rates are the Zero8 SMT connectors suitable?Which applications is the shielded version suitable for?Will the connection concept of the Zero8 compensate for tolerances in my application?
How can Zero8 SMT PCB connectors be processed?

The Zero8 PCB connector system is processed using surface-mount technology (SMT) and is therefore soldered directly onto the circuit boards. The  connectors are typically shipped in tape-and-reel packaging, enabling fully automatic pick-and-place processing. Positioning pins on the underside of the Zero8 connectors guarantee exact positioning on the circuit board. ept also guarantees that the contacts’ deviation from coplanarity is max. 0.1 mm to ensure proper soldering during processing.

How can circuit boards be connected with one another using the Zero8 SMT connectors?

The different types included in the product range of Zero8 connectors make it possible to connect PCBs in parallel arrangements with stack heights between 6 and 20 mm as well as in horizontal or perpendicular arrangements.

Zero8 LeiterplattenabstA nde parallel
Which currents can be transmitted with the Zero8 PCB connectors?

Thanks to the high-quality copper alloy and its excellent conductance values, up to 1.7 A can be carried at an ambient temperature of 20 °C with a 50-pin connector. These values are typically achieved with PCB connectors with a pitch dimension of min. 1.27 mm.

What is the highlight of the new connection concept?

Each half of the mating pair (plug or socket) contains both a male and a female contact. This double contacting approach guarantees reliable, gas-tight contacting in industrial environments and is resistant to external influences such as: shock, vibrations, thermocycles, corrosive gases, etc.
Contacting on the roller surface with high-quality finishing guarantees at least 500 mating cycles and reduces abrasion of the surface when exposed to micro-movements.

What does ScaleX technology stand for?

The ScaleX technology brand describes the scalability of the connector system during application as well as the advantages of the contact technology:

Reliable mechanical and electrical connections thanks to a double-sided contact system

Flexible device design: various numbers of contacts, construction types, and stack heights with a high degree of secure mating

Variability: board-to-board plug connectors in shielded and unshielded versions

Robustness: connecting technology for high levels of tolerance compensation and protection of the contacts

Data rates up to 16 Gbit/s: optionally available with closed shield concept for high EMC protection

Logo ScaleX rgb
For which data transmission rates are the Zero8 SMT connectors suitable?

Simulations with the Zero8 plug connector system at 16 Gbit/s demonstrate an outstanding level of signal integrity. We can provide you with the S-parameters for your application simulations; please contact us regarding this at sales@ept.de.

Which applications is the shielded version suitable for?

The shield concept guarantees optimal electromagnetic compatibility (EMC) in industrial applications and is suitable for all devices with internal high-speed transmission which are classified as sources of interference and/or interference suppressors:
Frequency inverters, power supply units, UPS systems, electric drives, switching devices, controllers, IO systems, medical devices, measuring technology, communications equipment, network technology, sensors, video transmission devices.

Will the connection concept of the Zero8 compensate for tolerances in my application?

The newly developed connection concept guarantees a high level of tolerance compensation during installation (angular offset of 2–4°, center offset of 0.7 mm) and also compensates for tolerances on the device side of 0.1 mm in the x and z directions and 0.8 mm in the y direction when connected.

Zero8 Mitten Winkelversatz