backDescriptionTechnical SpecificationsDerating DiagramMatching ProductsModificationsPackagingDownloadsStock Check
Zero8 socket low-profile shielded Part No. 406-52152-51
Illustration similar
Parallel
SMT
High Density
High Speed
Rugged
EMC
- 52 pins
- unmated stacking height: 4.85 mm
- EMC shielding
- SMT
- 0.8 mm pitch
- Performance level 1
ECAD, MCAD modelTechnical Specifications
Basics
| Performance Level IEC 60512-9-1:2010 | 1 |
|---|---|
| No. of Contacts | 52 |
| Termination Technology | SMT |
| Board-to-Board Distance | 6.0 mm to 15.0 mm |
| Operating Temperature Range | -55°C to + 125°C |
Material
| Insulator Material | LCP, UL 94 V-0 |
|---|---|
| CTI value IEC 60112 | 150 |
| Contact Material | Copper alloy |
| Plating | Au over Ni |
| Termination area | Sn over Ni |
Mechanical
| Pitch | 0.8 mm |
|---|---|
| Mating Force per Pin | ≤ 0.5 N |
| Separating Force per Pin | ≤ 0.4 N |
| Durability IEC 60512-9-1 | 500 mating cycles |
| Coplanarity | ≤ 0.1 mm |
| Vibration, sinusoidal IEC 60512-6-4 | 10 - 2000 Hz, 20g |
| Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5 | ≤ 1 µs |
| Shock, semi-sinusoidal IEC 60512-6-3 | 50g, 11 ms |
| Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5 | ≤ 1 µs |
Electrical
| Operational Current IEC 60512-5-2 | 1.7 A at 20°C (80 of 80 pins) 5.5 A at 20°C (2 of 80 pins) 5.1 A at 20°C (4 of 80 pins) 16 A at 20°C (shield of 80 pins) |
|---|---|
| Contact Resistance IEC 60512-2-1 | ≤ 20 mΩ |
| Clearance and Creepage | 0.25 mm |
| Insulation Resistance IEC 60512-3-1 | > 5 GΩ |
| Test Voltage IEC 60512-4-1 | 500 VAC |
| Data Transfer Rate | 16 Gbps |
Processing
| Soldering Temperature JEDEC J-STD-020E | 20 - 40 s at 260°C |
|---|---|
| MSL JEDEC J-STD-020E | 1 |
| Assembly | Pick and Place |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS konform |
Derating Diagram
Matching Products
Modifications
Available on request
- different number of pins
- other performance level
Packaging
Tape and Reel
500 pcs / Reel