Micro TCA – Power Connectors

MicroTCA® is based on the approach of plugging AdvancedMC™ modules directly into the backplane. The aim is to build smaller and more flexible systems independent of carrier boards and AdvancedTCA®. MicroTCA® is aimed at applications that do not require high levels of computing power, but in which low space requirements and low costs are paramount. It opens up further areas of application in the mid- and low-end range, such as in image processing, medical technology, or automation technology.
MTCA Power Backplane Connector Foto.jpg

Features

  • Meets PICMG requirements

Applications

  • Power applications
  • Image processing
  • Medical technology
  • Automation technology
Power

MTCA Power Module Output Part No. 501-50096-183

MTCA Power Module Output Foto
contacts: 72 signal, 24 power, Press-fit, according to PICMG specifications
Perpendicular
Press-fit
Power
Rugged
MTCA Power Module Output Part No. 501-50096-183 - Technical data

Basics

SpecificationPICMG® MTCA.0 R1.0
No. of Contacts96 (24 Power, 72 Signal)
Termination TechnologyPress-fit
Termination Length3.5 mm
Operating Temperature Range-55°C to +105°C

Material

Insulator MaterialPBT glass filled, UL 94 V-0
Contact MaterialCopper alloy

Mechanical

Mating Forcemax. 50 N
Separating Forcemax. 50 N
Durability200 mating cycles

Electrical

Operational CurrentPower contacts: max. 12 A, Signal contacts: max. 1 A
Insulation Resistance≥ 108 Ω
Test Voltage80 V r.m.s.

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant

MTCA Power Backplane Part No. 502-50096-183

MTCA Power Backplane Connector Foto
contacts: 72 signal, 24 power, Press-fit, according to PICMG specifications
Perpendicular
Press-fit
Power
Rugged
MTCA Power Backplane Part No. 502-50096-183 - Technical data

Basics

SpecificationPICMG® MTCA.0 R1.0
No. of Contacts96 (24 Power, 72 Signal)
Termination TechnologyPress-fit
Termination Length3.7 mm
Operating Temperature Range-55°C to +105°C

Material

Insulator MaterialPBT glass filled, UL 94 V-0
Contact MaterialCopper alloy

Mechanical

Mating Forcemax. 50 N
Separating Forcemax. 50 N
Durability200 mating cycles

Electrical

Operational CurrentPower contacts: max. 12 A, Signal contacts: max. 1 A
Insulation Resistance≥ 108 Ω
Test Voltage80 V r.m.s.

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant

Features

MTCA Anwendung Power
The connectors for MicroTCA and AdvancedTCA in press-fit technology enable high data transfer rates. The flat plate press-fitting technique enables simple press-fitting. The µTCA system uses a straight connector located directly on the backplane, whereas the ATCA system uses the angled AMC connector on the daughter card.
MTCA Power Backplane
MTCA Power Backplane

detail overview

image
Guide Pin
image
internal spring contacts
image
signal contacts max. 1 A
image
power contacts max. 12 A

AdvancedTCA® and MicroTCA® – PICMG Specifications:

TCA Logo 330px
AdvancedTCA® and MicroTCA® are specifications developed by PICMG® with the aim of enabling standardized hardware solutions to handle the increased data traffic as well as meeting new communication solutions.
AdvancedTCA® is primarily focused on the infrastructure of telecommunication systems that have high requirements on availability. AdvancedTCA® makes it possible to build modular systems using components from different manufacturers. This technology can offer the possibility of more quickly developing flexible and cost-effective setups than had been possible with the previously available proprietary systems.

The concept of AdvancedTCA® is based on a scalable, high-performance architecture, which is evident in its high functional density, availability, and future-proofing, offering a platform on which many future-oriented applications can be implemented. Scalable data transfer rates of several terabits per second, multi-protocol support, the integrability of new services, and the convergence of access, core and optical networks are just as much a part of this as the integration of data center functions. The high flexibility of the AdvancedTCA® architecture is evident in its support of interconnects with Gigabit Ethernet, Fibre Channel, Infiniband, StarFabric, PCI Express, and RapidIO. Another core element of the systems is the high availability of 99.999%.

PICMG® has developed the AdvancedMC™ (Advanced Mezzanine Card) standard to make the AdvancedTCA® system even more cost-effective. The AdvancedMC™ modules are small cards that plug into a carrier board (in the form of an AdvancedTCA® daughter card) in parallel as a mezzanine application. The actual application is realized via the AdvancedMC™ modules, whereas the carrier board contains only management functions.

MicroTCA® is now based on the approach of plugging AdvancedMC™ modules directly into the backplane. The aim is to build smaller and more flexible systems independent of carrier boards and AdvancedTCA®. MicroTCA® is aimed at applications that do not require high levels of computing power, but in which low space requirements and low costs are paramount. It opens up further areas of application in the mid- and low-end range, such as in image processing, medical technology, or automation technology.

Developer view:

ept offers power connectors that meet PICMG® specifications for MicroTCA® applications. ept connectors meet the highest quality standards and help make MicroTCA® systems much more reliable, while meeting PICMG requirements.

FAQ: