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- Description
- Technical Specifications
- Derating Diagram
- Matching Products
- Modifications
- Packaging
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One27 Female low-profile Part No. 404-52012-51
Illustration similar
Parallel
Perpendicular
SMT
High Density
Rugged
- 12 pins
- unmated stacking height: 6.25 mm
- for board-to-board distances from 8.0 to 12.6 mm
- SMT
- pitch 1.27 mm
- Performance level 1
Drawings
Further Information
ECAD, MCAD modelDelivery time
Technical Specifications
Basics
| No. of Contacts | 12 |
|---|---|
| Termination Technology | SMT |
| Board-to-Board Distance | 8.0 mm to 12.6 mm |
| Operating Temperature Range | -55°C to + 125°C |
Material
| Insulator Material | LCP, UL 94 V-0 |
|---|---|
| CTI value IEC 60112 | 175 |
| Contact Material | Copper alloy |
| Plating | Au over PdNi over Ni |
| Termination area | Sn over Ni |
Mechanical
| Pitch | 1.27 mm |
|---|---|
| Mating Force per Pin | ≤ 0.5 N |
| Separating Force per Pin | ≥ 0.1 N |
| Durability IEC 60512-9-1 | Performance level 1: 500 mating cycles |
| Coplanarity | ≤ 0.1 mm |
| Vibration, sinusoidal IEC 60512-6-4 | 10 - 2000 Hz, 20g |
| Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5 | ≤ 1 µs |
| Shock, semi-sinusoidal IEC 60512-6-3 | 50g, 11 ms |
| Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5 | ≤ 1 µs |
Electrical
| Operational Current IEC 60512-5-2 | 1.4 A at 20°C (50 pins) |
|---|---|
| Contact Resistance IEC 60512-2-1 | ≤ 25 mΩ |
| Clearance and Creepage | min. 0.4 mm |
| Insulation Resistance IEC 60512-3-1 | ≥ 10 GΩ |
| Test Voltage IEC 60512-4-1 | 500 VAC |
Processing
| Soldering Temperature JEDEC J-STD-020E | 20 - 40 s at 260°C |
|---|---|
| MSL JEDEC J-STD-020E | 1 |
| Assembly | Pick and Place |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
Derating Diagram
Matching Products
Modifications
Available on request
- different number of pins
- other performance level
Packaging
Tape and Reel
280 Stk / Reel