hm2.0 lower shield, type A Part No. 244-11600-1
Illustration similar
Perpendicular
Press-fit
- 22 contacts
- termination length 3.4 mm
- for PCB ≥ 1.44 mm
- tested according to IEC 61076-4-101
Technical Specifications
Basics
Specification | IEC 61076-4-101 |
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Performance Level | 2 |
No. of Contacts | 22 |
Termination Technology | Press-fit |
Termination Length | 3.4 mm |
Operating Temperature Range | -55°C to +125°C |
Material
Contact Material | Bronze |
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Mechanical
Pitch | 2.0 mm |
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Mating Force per Pin | Shielding: max. 1 N |
Separating Force per Pin | Shielding: min. 0.15 N |
Durability | > 250 mating cycles |
Electrical
Operational Current | 1.5 A @ +20°C, 1.0 A @ +70°C |
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Contact Resistance | max. 20 mΩ |
Insulation Resistance | min. 104 MΩ |
Test Voltage | 750 V r.m.s |
Data Transfer Rate | 3.125 Gbit/s |
Approval / Compliance
Environment | RoHS compliant |
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Hole Specifications
Material | imm. Sn printed circuit boards |
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Nominal Hole | Ø 0.6 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 0.60 ±0.05 mm |
C Drill Hole | 0.70 ±0.02 mm |
D Cu Plating | min. 25 µm |
E Surface | max. 1.5 µm; imm. Sn plating |
F Annular Ring | min. 0.1 mm |
Material | Ni, Au printed circuit boards |
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Nominal Hole | Ø 0.6 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 0.60 ±0.05 mm |
C Drill Hole | 0.70 ±0.02 mm |
D Cu Plating | min. 25 µm |
E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
F Annular Ring | min. 0.1 mm |
Material | pure Cu printed circuit boards |
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Nominal Hole | Ø 0.6 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 0.60 ±0.05 mm |
C Drill Hole | 0.70 ±0.02 mm |
D Cu Plating | min. 25 µm |
E Surface | OSP*,z.B. GLICOAT-SMD (F2) with 0.12 - 0.15 µm |
F Annular Ring | min. 0.1 mm |
Material | HAL Sn printed circuit boards |
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Nominal Hole | Ø 0.6 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 0.60 ±0.05 mm |
C Drill Hole | 0.70 ±0.02 mm |
D Cu Plating | min. 25 µm |
E Surface | HAL Sn, 5 - 15 µm |
F Annular Ring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5