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No. of Contacts | 4 |
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Termination Technology | Press-fit |
Board-to-Board Distance | 1 mm |
Operating Temperature Range | -55°C to +125°C |
Insulator Material | PBT glass filled |
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Contact Material | Copper alloy |
Plating | Sn |
Pitch | 2 mm |
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Operational Current | 11 A at +20°C per pin (5 contact bridges) |
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Contact Resistance | ≤ 5mΩ |
Clearance and Creepage | 1.4 mm |
Insulation Resistance | ≥ 10 GΩ |
Test Voltage | 1500 VDC |
UL file | E130314 |
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Environment | RoHS compliant |
For details please download the drawings or contact ept directly.
Material | imm. Sn printed circuit boards |
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Nominal Hole | Ø 1.0 mm |
A PCB Thickness | min 1.0 mm |
B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
C Drill Hole | 1.15 ±0.025 mm |
D Cu Plating | min. 25 µm |
E Surface | imm. Sn plating, max. 1.5 µm |
F Annular Ring | min. 0.1 mm |
Material | Ni, Au printed circuit boards |
---|---|
Nominal Hole | Ø 1.0 mm |
A PCB Thickness | min 1.0 mm |
B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
C Drill Hole | 1.15 ±0.025 mm |
D Cu Plating | min. 25 µm |
E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
F Annular Ring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Available on request
Bulk
250 pcs / Box
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