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Velox center Part No. 308-50101-41
Illustration similar
Perpendicular
Press-fit
High Speed
Rugged
- plating Press-fit Zone: SnPb
- custom loaded (135 contacts)
- termination technology: Press-fit
- pitch 1.8 mm
- data transfer rate 10 Gbit/s
Technical Specifications
Basics
Specification | VITA 46 |
---|---|
No. of Contacts | 135 |
Termination Technology | Press-fit |
Termination Length | 1.62 mm |
Operating Temperature Range | -55°C to +105°C |
Material
Insulator Material | LCP, UL 94 V-0 |
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CTI value IEC 60112 | 175 |
Contact Material | Phosphor Bronze |
Plating | 1.27 µm Au over Ni on contact area, SnPb on Press-fit zone |
Mechanical
Pitch | 1.8 mm |
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Mating Force per Pin | max. 0.75 N |
Separating Force per Pin | min. 0.15 N |
Durability | 200 mating cycles |
Electrical
Operational Current | 1.0 A (<30°C) |
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Operational Voltage | 50 VAC Peak or DC |
Contact Resistance | max. 80 mΩ |
Clearance and Creepage | ≥ 0.7 mm |
Insulation Resistance | min. 1000 MΩ |
Test Voltage | 500 V (AC/DC) |
Data Transfer Rate | 10 Gbit/s |
Approval / Compliance
UL file | E130314 |
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Hole Specifications
Material | imm. Sn printed circuit boards |
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Nominal Hole | Ø 0.56 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 0.56 ±0.05 mm |
C Drill Hole | 0.65 ±0.02 mm |
D Cu Plating | min. 25 µm |
E Surface | imm. Sn plating, max. 1.5 µm |
F Annular Ring | min. 0.1 mm |
Material | Ni, Au printed circuit boards |
---|---|
Nominal Hole | Ø 0.56 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 0.56 ±0.05 mm |
C Drill Hole | 0.65 ±0.02 mm |
D Cu Plating | min. 25 µm |
E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
F Annular Ring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Matching Products
Velox center
Part Number 308-50101-42
Accessories
Modifications
Available on request
- different custom loaded versions
Processing
Packaging
Tray
20 pcs / Tray
10 Tray / Box