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DIN 41612/IEC 60603-2

Highly Diverse and Time Proven
The DIN 41612/IEC 60603-2 product series consists of 12 basic types and other supplementary versions with a 2.54-mm or 5.08-mm pitch.The choices range from signal connectors with a current rating of up to 1.5 A to power connectors that can handle up to 5.6 A or even 15 A. The wealth of variants makes it possible to use this family of connectors for a very wide range of applications. Standardization ensures that the connectors are compatible with products from different manufacturers.

a tried and proven connection system
we also offer to perform special assembly for small batches
supports pre- and late mating contacts
available in a variety of termination lengths
a range of accessories, such as shrouds, board locks, coding keys
switching connector for daisy chaining

More information on DIN 41612

DIN 41612 Female straight, type C/3 Part No. 304-78106-04

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Description Technical Specifications Dimensions Derating Diagram Hole Specifications

Illustration similar

Termination length 17 mm
with plug-in zone in performance level 2
20 contacts
Press-fit
performance level 2

Further Information

Delivery time

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Basics

Specification	IEC 60603-2 (DIN 41612)
Performance Level	2
No. of Contacts	20
Termination Technology	Press-fit
Termination Length	17 mm
Board-to-Board Distance	16.85 mm
Operating Temperature Range	-55°C to +125°C

Material

Insulator Material	PBT glass filled UL 94 V-0
Contact Material	Copper alloy

Mechanical

Pitch	2.54 mm
Mating Force	< 18 N
Separating Force per Pin	> 0.15 N
Durability	400 mating cycles

Electrical

Operational Current	1.5 A
Contact Resistance	<20 mΩ
Clearance and Creepage	1.2 mm
Insulation Resistance	>10⁶ MΩ
Test Voltage	1000 V

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

DIN C3 FL Zeichnung Abmessungen1 DIN C3 FL Lochbild

For details please download the drawings or contact ept directly.

Material	imm. Sn printed circuit boards
Nominal Hole	Ø 1.0 mm
A PCB Thickness	min 1.44 mm
B Plated Hole	Ø 1.0 +0.09 / -0.06 mm
C Drill Hole	1.15 ±0.025 mm
D Cu Plating	min. 25 µm
E Surface	imm. Sn plating, max. 1.5 µm
F Annular Ring	min. 0.1 mm

Material	Ni, Au printed circuit boards
Nominal Hole	Ø 1.0 mm
A PCB Thickness	min 1.44 mm
B Plated Hole	Ø 1.0 +0.09 / -0.06 mm
C Drill Hole	1.15 ±0.025 mm
D Cu Plating	min. 25 µm
E Surface	Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni
F Annular Ring	min. 0.1 mm

Material	pure Cu printed circuit boards
Nominal Hole	Ø 1.0 mm
A PCB Thickness	min 1.44 mm
B Plated Hole	Ø 1.0 +0.09 / -0.06 mm
C Drill Hole	1.15 ±0.025 mm
D Cu Plating	min. 25 µm
E Surface	OSP*, z.B. GLICOAT-SMD (F2) with 0.12 - 0.15 µm
F Annular Ring	min. 0.1 mm

Material	HAL Sn printed circuit boards
Nominal Hole	Ø 1.0 mm
A PCB Thickness	min 1.44 mm
B Plated Hole	Ø 1.0 +0.09 / -0.06 mm
C Drill Hole	1.15 ±0.025 mm
D Cu Plating	min. 25 µm
E Surface	HAL Sn, 5 - 15 µm
F Annular Ring	min. 0.1 mm