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hm2.0 Female connector, type B22 Part No. 244-22000-15
Illustration similar
Perpendicular
Press-fit
- 110 contacts
- termination length 2.9 mm
- for PCB ≥ 1.44 mm
- without shielding
- tested according to IEC 61076-4-101
Technical Specifications
Basics
| Specification | IEC 61076-4-101 |
|---|---|
| Performance Level | 2 |
| No. of Contacts | 110 |
| Termination Technology | Press-fit |
| Termination Length | 2.9 mm |
| Operating Temperature Range | -55°C to +125°C |
Material
| Insulator Material | PBT glass filled, UL 94 V-0 |
|---|---|
| CTI value IEC 60112 | 200 |
| Contact Material | Bronze |
Mechanical
| Pitch | 2.0 mm |
|---|---|
| Mating Force per Pin | Contact: max. 0.75 N, Shielding: max. 1 N |
| Separating Force per Pin | Contact: min. 0.15 N, Shielding: min. 0.15 N |
| Durability | > 250 mating cycles |
Electrical
| Operational Current | 1.5 A @ +20°C, 1.0 A @ +70°C |
|---|---|
| Contact Resistance | max. 20 mΩ |
| Clearance and Creepage | ≥ 0.6 mm |
| Insulation Resistance | min. 104 MΩ |
| Test Voltage | 750 V r.m.s |
| Data Transfer Rate | 3.125 Gbit/s |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
Derating Diagram
Hole Specifications
| Material | imm. Sn printed circuit boards |
|---|---|
| Nominal Hole | Ø 0.6 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 0.60 ±0.05 mm |
| C Drill Hole | 0.70 ±0.02 mm |
| D Cu Plating | min. 25 µm |
| E Surface | max. 1.5 µm; imm. Sn plating |
| F Annular Ring | min. 0.1 mm |
| Material | Ni, Au printed circuit boards |
|---|---|
| Nominal Hole | Ø 0.6 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 0.60 ±0.05 mm |
| C Drill Hole | 0.70 ±0.02 mm |
| D Cu Plating | min. 25 µm |
| E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
| F Annular Ring | min. 0.1 mm |
| Material | pure Cu printed circuit boards |
|---|---|
| Nominal Hole | Ø 0.6 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 0.60 ±0.05 mm |
| C Drill Hole | 0.70 ±0.02 mm |
| D Cu Plating | min. 25 µm |
| E Surface | OSP*,z.B. GLICOAT-SMD (F2) with 0.12 - 0.15 µm |
| F Annular Ring | min. 0.1 mm |
| Material | HAL Sn printed circuit boards |
|---|---|
| Nominal Hole | Ø 0.6 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 0.60 ±0.05 mm |
| C Drill Hole | 0.70 ±0.02 mm |
| D Cu Plating | min. 25 µm |
| E Surface | HAL Sn, 5 - 15 µm |
| F Annular Ring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Modifications
Available on request
- other contact surface
- also in THTR
Processing
Packaging
Tray
35 pcs / Tray
4 Tray / Box